Cell operation monitoring

ABSTRACT

Memory devices adapted to process and generate analog data signals representative of data values of two or more bits of information facilitate increases in data transfer rates relative to devices processing and generating only binary data signals indicative of individual bits. Programming of such memory devices includes programming to a target threshold voltage range representative of the desired bit pattern. Reading such memory devices includes generating an analog data signal indicative of a threshold voltage of a target memory cell. Atypical cell, block, string, column, row, etc. . . . operation is monitored and locations and type of atypical operation stored. Adjustment of operation is performed based upon the atypical cell operation.

RELATED APPLICATION

This application is a Continuation of U.S. application Ser. No.12/017,905, titled “CELL OPERATION MONITORING,” filed Jan. 22, 2008 andissued as U.S. Pat. No. 8,159,874 on Apr. 17, 2012, which is commonlyassigned and incorporated herein by reference.

FIELD

The present disclosure relates generally to semiconductor memory, and inparticular, the present disclosure relates to solid state non-volatilememory devices and systems utilizing analog signals to communicate datavalues of two or more bits of information.

BACKGROUND

Electronic devices commonly have some type of bulk storage deviceavailable to them. A common example is a hard disk drive (HDD). HDDs arecapable of large amounts of storage at relatively low cost, with currentconsumer HDDs available with over one terabyte of capacity.

HDDs generally store data on rotating magnetic media or platters. Datais typically stored as a pattern of magnetic flux reversals on theplatters. To write data to a typical HDD, the platter is rotated at highspeed while a write head floating above the platter generates a seriesof magnetic pulses to align magnetic particles on the platter torepresent the data. To read data from a typical HDD, resistance changesare induced in a magnetoresistive read head as it floats above theplatter rotated at high speed. In practice, the resulting data signal isan analog signal whose peaks and valleys are the result of the magneticflux reversals of the data pattern. Digital signal processing techniquescalled partial response maximum likelihood (PRML) are then used tosample the analog data signal to determine the likely data patternresponsible for generating the data signal.

HDDs have certain drawbacks due to their mechanical nature. HDDs aresusceptible to damage or excessive read/write errors due to shock,vibration or strong magnetic fields. In addition, they are relativelylarge users of power in portable electronic devices.

Another example of a bulk storage device is a solid state drive (SSD).Instead of storing data on rotating media, SSDs utilize semiconductormemory devices to store their data, but include an interface and formfactor making them appear to their host system as if they are a typicalHDD. The memory devices of SSDs are typically non-volatile flash memorydevices.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications. Flashmemory devices typically use a one-transistor memory cell that allowsfor high memory densities, high reliability, and low power consumption.Changes in threshold voltage of the cells, through programming of chargestorage or trapping layers or other physical phenomena, determine thedata value of each cell. Common uses for flash memory and othernon-volatile memory include personal computers, personal digitalassistants (PDAs), digital cameras, digital media players, digitalrecorders, games, appliances, vehicles, wireless devices, mobiletelephones, and removable memory modules, and the uses for non-volatilememory continue to expand.

Unlike HDDs, the operation of SSDs is generally not subject tovibration, shock or magnetic field concerns due to their solid statenature. Similarly, without moving parts, SSDs have lower powerrequirements than HDDs. However, SSDs currently have much lower storagecapacities compared to HDDs of the same form factor and a significantlyhigher cost per bit.

For the reasons stated above, and for other reasons which will becomeapparent to those skilled in the art upon reading and understanding thepresent specification, there is a need in the art for alternative bulkstorage options.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a simplified block diagram of a memory device according to anembodiment of the disclosure.

FIG. 2 is a schematic of a portion of an example NAND memory array asmight be found in the memory device of FIG. 1.

FIG. 3 is a block schematic of a solid state bulk storage device inaccordance with one embodiment of the present disclosure.

FIG. 4 is a depiction of a wave form showing conceptually a data signalas might be received from the memory device by a read/write channel inaccordance with an embodiment of the disclosure.

FIG. 5 is a block schematic of an electronic system in accordance withan embodiment of the disclosure.

FIG. 6 is a flow chart diagram of a method in accordance with anembodiment of the disclosure.

FIG. 7 is a simplified block diagram of a memory device in accordancewith another embodiment of the disclosure.

DETAILED DESCRIPTION

In the following detailed description of the present embodiments,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration specific embodiments inwhich the embodiments may be practiced. These embodiments are describedin sufficient detail to enable those skilled in the art to practice theinvention, and it is to be understood that other embodiments may beutilized and that process, electrical or mechanical changes may be madewithout departing from the scope of the present disclosure. Thefollowing detailed description is, therefore, not to be taken in alimiting sense.

Traditional solid-state memory devices pass data in the form of binarysignals. Typically, a ground potential represents a first logic level ofa bit of data, e.g., a ‘0’ data value, while a supply potentialrepresents a second logic level of a bit of data, e.g., a ‘1’ datavalue. A multi-level cell (MLC) may be assigned, for example, fourdifferent threshold voltage (Vt) ranges of 200 mV for each range, witheach range corresponding to a distinct data state, thereby representingfour data values or bit patterns. Typically, a dead space or margin of0.2V to 0.4V is between each range to keep the Vt distributions fromoverlapping. If the Vt of the cell is within the first range, the cellmay be deemed to store a logical 11 state and is typically consideredthe erased state of the cell. If the Vt is within the second range, thecell may be deemed to store a logical 10 state. If the Vt is within thethird range, the cell may be deemed to store a logical 00 state. And ifthe Vt is within the fourth range, the cell may be deemed to store alogical 01 state.

When programming a traditional MLC device as described above, cells aregenerally first erased, as a block, to correspond to the erased state.Following erasure of a block of cells, the least-significant bit (LSB)of each cell is first programmed, if necessary. For example, if the LSBis a 1, then no programming is necessary, but if the LSB is a 0, thenthe Vt of the target memory cell is moved from the Vt rangecorresponding to the 11 logic state to the Vt range corresponding to the10 logic state. Following programming of the LSBs, the most-significantbit (MSB) of each cell is programmed in a similar manner, shifting theVt where necessary. When reading an MLC of a traditional memory device,one or more read operations determine generally into which of the rangesthe Vt of the cell voltage falls. For example, a first read operationmay determine whether the Vt of the target memory cell is indicative ofthe MSB being a 1 or a 0 while a second read operation may determinewhether the Vt of the target memory cell in indicative of the LSB beinga 1 or a 0. In each case, however, a single bit is returned from a readoperation of a target memory cell, regardless of how many bits arestored on each cell. This problem of multiple program and readoperations becomes increasingly troublesome as more bits are stored oneach MLC. Because each such program or read operation is a binaryoperation, i.e., each programs or returns a single bit of informationper cell, storing more bits on each MLC leads to longer operation times.

The memory devices of an illustrative embodiment store data as Vt rangeson the memory cells. In contrast to traditional memory devices, however,program and read operations are capable of utilizing data signals not asdiscrete bits of MLC data values, but as full representations of MLCdata values, such as their complete bit patterns. For example, in atwo-bit MLC device, instead of programming a cell's LSB and subsequentlyprogramming that cell's MSB, a target threshold voltage may beprogrammed representing the bit pattern of those two bits. That is, aseries of program and verify operations would be applied to a memorycell until that memory cell obtained its target threshold voltage ratherthan programming to a first threshold voltage for a first bit, shiftingto a second threshold voltage for a second bit, etc. Similarly, insteadof utilizing multiple read operations to determine each bit stored on acell, the threshold voltage of the cell may be determined and passed asa single signal representing the complete data value or bit pattern ofthe cell. The memory devices of the various embodiments do not merelylook to whether a memory cell has a threshold voltage above or belowsome nominal threshold voltage as is done in traditional memory devices.Instead, a voltage signal is generated that is representative of theactual threshold voltage of that memory cell across the continuum ofpossible threshold voltages. An advantage of this approach becomes moresignificant as the bits per cell count is increased. For example, if thememory cell were to store eight bits of information, a single readoperation would return a single analog data signal representative ofeight bits of information.

FIG. 1 is a simplified block diagram of a memory device 101 according toan embodiment of the disclosure. Memory device 101 includes an array ofmemory cells 104 arranged in rows and columns. Although the variousembodiments will be described primarily with reference to NAND memoryarrays, the various embodiments are not limited to a specificarchitecture of the memory array 104. Some examples of other arrayarchitectures suitable for the present embodiments include NOR arrays,AND arrays, and virtual ground arrays. In general, however, theembodiments described herein are adaptable to any array architecturepermitting generation of a data signal indicative of the thresholdvoltage of each memory cell.

A row decode circuitry 108 and a column decode circuitry 110 areprovided to decode address signals provided to the memory device 101.Address signals are received and decoded to access memory array 104.Memory device 101 also includes input/output (I/O) control circuitry 112to manage input of commands, addresses and data to the memory device 101as well as output of data and status information from the memory device101. An address register 114 is coupled between I/O control circuitry112 and row decode circuitry 108 and column decode circuitry 110 tolatch the address signals prior to decoding. A command register 124 iscoupled between I/O control circuitry 112 and control logic 116 to latchincoming commands. Control logic 116 controls access to the memory array104 in response to the commands and generates status information for theexternal processor 130. The control logic 116 is coupled to row decodecircuitry 108 and column decode circuitry 110 to control the row decodecircuitry 108 and column decode circuitry 110 in response to theaddresses.

Control logic 116 is also coupled to a sample and hold circuitry 118.The sample and hold circuitry 118 latches data, either incoming oroutgoing, in the form of analog voltage levels. For example, the sampleand hold circuitry could contain capacitors or other analog storagedevices for sampling either an incoming voltage signal representing datato be written to a memory cell or an outgoing voltage signal indicativeof the threshold voltage sensed from a memory cell. The sample and holdcircuitry 118 may further provide for amplification and/or buffering ofthe sampled voltage to provide a stronger data signal to an externaldevice.

The handling of analog voltage signals may take an approach similar toan approach well known in the area of CMOS imager technology, wherecharge levels generated at pixels of the imager in response to incidentillumination are stored on capacitors. These charge levels are thenconverted to voltage signals using a differential amplifier with areference capacitor as a second input to the differential amplifier. Theoutput of the differential amplifier is then passed to analog-to-digitalconversion (ADC) devices to obtain a digital value representative of anintensity of the illumination. In the present embodiments, a charge maybe stored on a capacitor in response to subjecting it to a voltage levelindicative of an actual or target threshold voltage of a memory cell forreading or programming, respectively, the memory cell. This charge couldthen be converted to an analog voltage using a differential amplifierhaving a grounded input or other reference signal as a second input. Theoutput of the differential amplifier could then be passed to the I/Ocontrol circuitry 112 for output from the memory device, in the case ofa read operation, or used for comparison during one or more verifyoperations in programming the memory device. It is noted that the I/Ocontrol circuitry 112 could optionally include analog-to-digitalconversion functionality and digital-to-analog conversion (DAC)functionality to convert read data from an analog signal to a digitalbit pattern and to convert write data from a digital bit pattern to ananalog signal such that the memory device 101 could be adapted forcommunication with either an analog or digital data interface.

During a write operation, target memory cells of the memory array 104are programmed until voltages indicative of their Vt levels match thelevels held in the sample and hold circuitry 118. This can beaccomplished, as one example, using differential sensing devices tocompare the held voltage level to a threshold voltage of the targetmemory cell. Much like traditional memory programming, programmingpulses could be applied to a target memory cell to increase itsthreshold voltage until reaching or exceeding the desired value. In aread operation, the Vt levels of the target memory cells are passed tothe sample and hold circuitry 118 for transfer to an external processor(not shown in FIG. 1) either directly as analog signals or as digitizedrepresentations of the analog signals depending upon whether ADC/DACfunctionality is provided external to, or within, the memory device.

Threshold voltages of cells may be determined in a variety of manners.For example, a word line voltage could be sampled at the point when thetarget memory cell becomes activated. Alternatively, a boosted voltagecould be applied to a first source/drain side of a target memory cell,and the threshold voltage could be taken as a difference between itscontrol gate voltage and the voltage at its other source/drain side. Bycoupling the voltage to a capacitor, charge would be shared with thecapacitor to store the sampled voltage. Note that the sampled voltageneed not be equal to the threshold voltage, but merely indicative ofthat voltage. For example, in the case of applying a boosted voltage toa first source/drain side of the memory cell and a known voltage to itscontrol gate, the voltage developed at the second source/drain side ofthe memory cell could be taken as the data signal as the developedvoltage is indicative of the threshold voltage of the memory cell.

Sample and hold circuitry 118 may include caching, i.e., multiplestorage locations for each data value, such that the memory device 101may be reading a next data value while passing a first data value to theexternal processor, or receiving a next data value while writing a firstdata value to the memory array 104. A status register 122 is coupledbetween I/O control circuitry 112 and control logic 116 to latch thestatus information for output to the external processor.

Memory device 101 receives control signals at control logic 116 over acontrol link 132. The control signals may include a chip enable CE#, acommand latch enable CLE, an address latch enable ALE, and a writeenable WE#. Memory device 101 may receive commands (in the form ofcommand signals), addresses (in the form of address signals), and data(in the form of data signals) from an external processor over amultiplexed input/output (I/O) bus 134 and output data to the externalprocessor over I/O bus 134.

In a specific example, commands are received over input/output (I/O)pins [7:0] of I/O bus 134 at I/O control circuitry 112 and are writteninto command register 124. The addresses are received over input/output(I/O) pins [7:0] of bus 134 at I/O control circuitry 112 and are writteninto address register 114. The data may be received over input/output(I/O) pins [7:0] for a device capable of receiving eight parallelsignals, or input/output (I/O) pins [15:0] for a device capable ofreceiving sixteen parallel signals, at I/O control circuitry 112 and aretransferred to sample and hold circuitry 118. Data also may be outputover input/output (I/O) pins [7:0] for a device capable of transmittingeight parallel signals or input/output (I/O) pins [15:0] for a devicecapable of transmitting sixteen parallel signals. It will be appreciatedby those skilled in the art that additional circuitry and signals can beprovided, and that the memory device of FIG. 1 has been simplified tohelp focus on the embodiments of the disclosure. Additionally, while thememory device of FIG. 1 has been described in accordance with popularconventions for receipt and output of the various signals, it is notedthat the various embodiments are not limited by the specific signals andI/O configurations described unless expressly noted herein. For example,command and address signals could be received at inputs separate fromthose receiving the data signals, or data signals could be transmittedserially over a single I/O line of I/O bus 134. Because the data signalsrepresent bit patterns instead of individual bits, serial communicationof an 8-bit data signal could be as efficient as parallel communicationof eight signals representing individual bits.

FIG. 2 is a schematic of a portion of an example NAND memory array 200as might be found in the memory array 104 of FIG. 1. As shown in FIG. 2,the memory array 200 includes word lines 202 ₁ to 202 _(N) andintersecting bit lines 204 ₁ to 204 _(M). For ease of addressing in thedigital environment, the number of word lines 202 and the number of bitlines 204 are generally each some power of two.

Memory array 200 includes NAND strings 206 ₁ to 206 _(M). Each NANDstring includes transistors 208 ₁ to 208 _(N), each located at anintersection of a word line 202 and a bit line 204. The transistors 208,depicted as floating-gate transistors in FIG. 2, represent non-volatilememory cells for storage of data. The floating-gate transistors 208 ofeach NAND string 206 are connected in series source to drain between oneor more source select gates 210, e.g., a field-effect transistor (FET),and one or more drain select gates 212, e.g., an FET. Each source selectgate 210 is located at an intersection of a local bit line 204 and asource select line 214, while each drain select gate 212 is located atan intersection of a local bit line 204 and a drain select line 215.

A source of each source select gate 210 is connected to a common sourceline 216. The drain of each source select gate 210 is connected to thesource of the first floating-gate transistor 208 of the correspondingNAND string 206. For example, the drain of source select gate 210 ₁ isconnected to the source of floating-gate transistor 208 ₁ of thecorresponding NAND string 206 ₁. A control gate of each source selectgate 210 is connected to source select line 214. If multiple sourceselect gates 210 are utilized for a given NAND string 206, they would becoupled in series between the common source line 216 and the firstfloating-gate transistor 208 of that NAND string 206.

The drain of each drain select gate 212 is connected to a local bit line204 for the corresponding NAND string at a drain contact. For example,the drain of drain select gate 212 ₁ is connected to the local bit line204 ₁ for the corresponding NAND string 206 ₁ at a drain contact. Thesource of each drain select gate 212 is connected to the drain of thelast floating-gate transistor 208 of the corresponding NAND string 206.For example, the source of drain select gate 212 ₁ is connected to thedrain of floating-gate transistor 208 _(N) of the corresponding NANDstring 206 ₁. If multiple drain select gates 212 are utilized for agiven NAND string 206, they would be coupled in series between thecorresponding bit line 204 and the last floating-gate transistor 208_(N) of that NAND string 206.

Typical construction of floating-gate transistors 208 includes a source230 and a drain 232, a floating gate 234, and a control gate 236, asshown in FIG. 2. Floating-gate transistors 208 have their control gates236 coupled to a word line 202. A column of the floating-gatetransistors 208 are those NAND strings 206 coupled to a given local bitline 204. A row of the floating-gate transistors 208 are thosetransistors commonly coupled to a given word line 202. Other forms oftransistors 208 may also be utilized with embodiments of the disclosure,such as NROM, magnetic or ferroelectric transistors and othertransistors capable of being programmed to assume one of two or morethreshold voltage ranges.

Memory devices of the various embodiments may be advantageously used inbulk storage devices. For various embodiments, these bulk storagedevices may take on the same form factor and communication bus interfaceof traditional HDDs, thus allowing them to replace such drives in avariety of applications. Some common form factors for HDDs include the3.5″, 2.5″ and PCMCIA (Personal Computer Memory Card InternationalAssociation) form factors commonly used with current personal computersand larger digital media recorders, as well as 1.8″ and 1″ form factorscommonly used in smaller personal appliances, such as mobile telephones,personal digital assistants (PDAs) and digital media players. Somecommon bus interfaces include universal serial bus (USB), AT attachmentinterface (ATA) [also known as integrated drive electronics or IDE],serial ATA (SATA), small computer systems interface (SCSI) and theInstitute of Electrical and Electronics Engineers (IEEE) 1394 standard.While a variety of form factors and communication interfaces werelisted, the embodiments are not limited to a specific form factor orcommunication standard. Furthermore, the embodiments need not conform toa HDD form factor or communication interface. FIG. 3 is a blockschematic of a solid state bulk storage device 300 in accordance withone embodiment of the present disclosure.

The bulk storage device 300 includes a memory device 301 in accordancewith an embodiment of the disclosure, a read/write channel 305 and acontroller 310. The read/write channel 305 provides foranalog-to-digital conversion of data signals received from the memorydevice 301 as well as digital-to-analog conversion of data signalsreceived from the controller 310. The controller 310 provides forcommunication between the bulk storage device 300 and an externalprocessor (not shown in FIG. 3) through bus interface 315. It is notedthat the read/write channel 305 could service one or more additionalmemory devices, as depicted by memory device 301′ in dashed lines.Selection of a single memory device 301 for communication can be handledthrough a multi-bit chip enable signal or other multiplexing scheme.

The memory device 301 is coupled to a read/write channel 305 through ananalog interface 320 and a digital interface 325. The analog interface320 provides for the passage of analog data signals between the memorydevice 301 and the read/write channel 305 while the digital interface325 provides for the passage of control signals, command signals andaddress signals from the read/write channel 305 to the memory device301. The digital interface 325 may further provide for the passage ofstatus signals from the memory device 301 to the read/write channel 305.The analog interface 320 and the digital interface 325 may share signallines as noted with respect to the memory device 101 of FIG. 1. Althoughthe embodiment of FIG. 3 depicts a dual analog/digital interface to thememory device, functionality of the read/write channel 305 couldoptionally be incorporated into the memory device 301 as discussed withrespect to FIG. 1 such that the memory device 301 communicates directlywith the controller 310 using only a digital interface for passage ofcontrol signals, command signals, status signals, address signals anddata signals.

The read/write channel 305 is coupled to the controller 310 through oneor more interfaces, such as a data interface 330 and a control interface335. The data interface 330 provides for the passage of digital datasignals between the read/write channel 305 and the controller 310. Thecontrol interface 335 provides for the passage of control signals,command signals and address signals from the controller 310 to theread/write channel 305. The control interface 335 may further providefor the passage of status signals from the read/write channel 305 to thecontroller 310. Status and command/control signals may also be passeddirectly between the controller 310 and the memory device 301 asdepicted by the dashed line connecting the control interface 335 to thedigital interface 325.

Although depicted as two distinct devices in FIG. 3, the functionalityof the read/write channel 305 and the controller 310 could alternativelybe performed by a single integrated circuit device. And whilemaintaining the memory device 301 as a separate device would providemore flexibility in adapting the embodiments to different form factorsand communication interfaces, because it is also an integrated circuitdevice, the entire bulk storage device 300 could be fabricated as asingle integrated circuit device.

The read/write channel 305 is a signal processor adapted to at leastprovide for conversion of a digital data stream to an analog data streamand vice versa. A digital data stream provides data signals in the formof binary voltage levels, i.e., a first voltage level indicative of abit having a first binary data value, e.g., 0, and a second voltagelevel indicative of a bit having a second binary data value, e.g., 1. Ananalog data stream provides data signals in the form of analog voltageshaving more than two levels, with different voltage levels or rangescorresponding to different bit patterns of two or more bits. Forexample, in a system adapted to store two bits per memory cell, a firstvoltage level or range of voltage levels of an analog data stream couldcorrespond to a bit pattern of 11, a second voltage level or range ofvoltage levels of an analog data stream could correspond to a bitpattern of 10, a third voltage level or range of voltage levels of ananalog data stream could correspond to a bit pattern of 00 and a fourthvoltage level or range of voltage levels of an analog data stream couldcorrespond to a bit pattern of 01. Thus, one analog data signal inaccordance with the various embodiments would be converted to two ormore digital data signals, and vice versa.

In practice, control and command signals are received at the businterface 315 for access of the memory device 301 through the controller310. Addresses and data values may also be received at the bus interface315 depending upon what type of access is desired, e.g., write, read,format, etc. In a shared bus system, the bus interface 315 would becoupled to a bus along with a variety of other devices. To directcommunications to a specific device, an identification value may beplaced on the bus indicating which device on the bus is to act upon asubsequent command. If the identification value matches the value takenon by the bulk storage device 300, the controller 310 would then acceptthe subsequent command at the bus interface 315. If the identificationvalue did not match, the controller 310 would ignore the subsequentcommunication. Similarly, to avoid collisions on the bus, the variousdevices on a shared bus may instruct other devices to cease outboundcommunication while they individually take control of the bus. Protocolsfor bus sharing and collision avoidance are well known and will not bedetailed herein. The controller 310 then passes the command, address anddata signals on to the read/write channel 305 for processing. Note thatthe command, address and data signals passed from the controller 310 tothe read/write channel 305 need not be the same signals received at thebus interface 315. For example, the communication standard for the businterface 315 may differ from the communication standard of theread/write channel 305 or the memory device 301. In this situation, thecontroller 310 may translate the commands and/or addressing scheme priorto accessing the memory device 301. In addition, the controller 310 mayprovide for load leveling within the one or more memory devices 301,such that physical addresses of the memory devices 301 may change overtime for a given logical address. Thus, the controller 310 would map thelogical address from the external device to a physical address of atarget memory device 301.

For write requests, in addition to the command and address signals, thecontroller 310 would pass digital data signals to the read/write channel305. For example, for a 16-bit data word, the controller 310 would pass16 individual signals having a first or second binary logic level. Theread/write channel 305 would then convert the digital data signals to ananalog data signal representative of the bit pattern of the digital datasignals. To continue with the foregoing example, the read/write channel305 would use a digital-to-analog conversion to convert the 16individual digital data signals to a single analog signal having apotential level indicative of the desired 16-bit data pattern. For oneembodiment, the analog data signal representative of the bit pattern ofthe digital data signals is indicative of a desired threshold voltage ofthe target memory cell. However, in programming of a one-transistormemory cells, it is often the case that programming of neighboringmemory cells will increase the threshold voltage of previouslyprogrammed memory cells. Thus, for another embodiment, the read/writechannel 305 can take into account these types of expected changes in thethreshold voltage, and adjust the analog data signal to be indicative ofa threshold voltage lower than the final desired threshold voltage.After conversion of the digital data signals from the controller 310,the read/write channel 305 would then pass the write command and addresssignals to the memory device 301 along with the analog data signals foruse in programming the individual memory cells. Programming can occur ona cell-by-cell basis, but is generally performed for a page of data peroperation. For a typical memory array architecture, a page of dataincludes every other memory cell coupled to a word line.

For read requests, the controller would pass command and address signalsto the read/write channel 305. The read/write channel 305 would pass theread command and address signals to the memory device 301. In response,after performing the read operation, the memory device 301 would returnthe analog data signals indicative of the threshold voltages of thememory cells defined by the address signals and the read command. Thememory device 301 may transfer its analog data signals in parallel orserial fashion.

The analog data signals may also be transferred not as discrete voltagepulses, but as a substantially continuous stream of analog signals. Inthis situation, the read/write channel 305 may employ signal processingsimilar to that used in HDD accessing called PRML or partial response,maximum likelihood. In PRML processing of a traditional HDD, the readhead of the HDD outputs a stream of analog signals representative offlux reversals encountered during a read operation of the HDD platter.Rather than attempting to capture the true peaks and valleys of thisanalog signal generated in response to flux reversals encountered by theread head, the signal is periodically sampled to create a digitalrepresentation of the signal pattern. This digital representation canthen be analyzed to determine the likely pattern of flux reversalsresponsible for generation of the analog signal pattern. This same typeof processing can be utilized with embodiments of the presentdisclosure. By sampling the analog signal from the memory device 301,PRML processing can be employed to determine the likely pattern ofthreshold voltages responsible for generation of the analog signal.

FIG. 4 is a depiction of a wave form showing conceptually a data signal450 as might be received from the memory device 301 by the read/writechannel 305 in accordance with an embodiment of the disclosure. The datasignal 450 could be periodically sampled and a digital representation ofthe data signal 450 can be created from the amplitudes of the sampledvoltage levels. For one embodiment, the sampling could be synchronizedto the data output such that sampling occurs during the steady-stateportions of the data signal 450. Such an embodiment is depicted by thesampling as indicated by the dashed lines at times t1, t2, t3 and t4.However, if synchronized sampling becomes misaligned, values of the datasamples may be significantly different than the steady-state values. Inan alternate embodiment, sampling rates could be increased to allowdetermination of where steady-state values likely occurred, such as byobserving slope changes indicated by the data samples. Such anembodiment is depicted by the sampling as indicated by the dashed linesat times t5, t6, t7 and t8, where a slope between data samples at timest6 and t7 may indicate a steady-state condition. In such an embodiment,a trade-off is made between sampling rate and accuracy of therepresentation. Higher sampling rates lead to more accuraterepresentations, but also increase processing time. Regardless ofwhether sampling is synchronized to the data output or more frequentsampling is used, the digital representation can then be used to predictwhat incoming voltage levels were likely responsible for generating theanalog signal pattern. In turn, the likely data values of the individualmemory cells being read can be predicted from this expected pattern ofincoming voltage levels.

Recognizing that errors will occur in the reading of data values fromthe memory device 301, the read/write channel 305 may include errorcorrection. Error correction is commonly used in memory devices, as wellas HDDs, to recover from expected errors. Typically, a memory devicewill store user data in a first set of locations and error correctioncode (ECC) in a second set of locations. During a read operation, boththe user data and the ECC are read in response to a read request of theuser data. Using known algorithms, the user data returned from the readoperation is compared to the ECC. If the errors are within the limits ofthe ECC, the errors will be corrected.

FIG. 5 is a block schematic of an electronic system in accordance withan embodiment of the disclosure. Example electronic systems may includepersonal computers, PDAs, digital cameras, digital media players,digital recorders, electronic games, appliances, vehicles, wirelessdevices, mobile telephones and the like.

The electronic system includes a host processor 500 that may includecache memory 502 to increase the efficiency of the processor 500. Theprocessor 500 is coupled to a communication bus 504. A variety of otherdevices may be coupled to the communication bus 504 under control of theprocessor 500. For example, the electronic system may include randomaccess memory (RAM) 506; one or more input devices 508 such askeyboards, touch pads, pointing devices, etc.; an audio controller 510;a video controller 512; and one or more bulk storage devices 514. Atleast one bulk storage device 514 includes a digital bus interface 515for communication with the bus 504, one or more memory devices inaccordance with an embodiment of the disclosure having an analoginterface for transfer of data signals representative of data patternsof two or more bits of data, and a signal processor adapted to performdigital-to-analog conversion of digital data signals received from thebus interface 515 and analog-to-digital conversion of analog datasignals received from its memory device(s).

Cell Operation Monitoring

Certain cells in multi-level memories such as those described hereinhave atypical operation, such as programming and/or sensing at differentspeeds, either faster or slower than typical cells, high error rates,threshold voltage variances, etc. . . . Cells that program faster thanthe cells around them can have issues with over-programming or otherissues if they are repeatedly subjected to programming pulses in anormal programming cycle even though they are already programmed. Cellsthat program slower than cells around them can cause issues with thosecells around them similar to those discussed for fast programming cells.Further, slow programming cells can be unusable if they do not programat all, or do not program within a normal programming cycle ofprogramming pulses. Cells with high error rates on programming and/orsensing, or that have threshold voltage variances after programmingand/or at sensing can also cause problems with reliability.

Sometimes in memories such as those described herein, blocks, strings,columns, sections, etc. . . . , of cells program and/or sense faster orslower than the blocks, sections, or cells around them, and can causethe same types of issues described above with respect to single cells,but on a larger scale. Further, individual cells or blocks, strings,columns, sections, etc. . . . , of cells can have problems with higherror rates or threshold voltage variances as well.

In one embodiment, identifying information, such as an indication oflocations of cells with atypical programming and/or sensing issues, forexample those cells that program and/or sense faster than surroundingcells, slower than surrounding cells, having high error rates, or highthreshold voltage variances, are stored in a storage area or table, suchas a lookup table or register, within the memory device. When a problemcell contained in the table is to be programmed or sensed, the type ofatypical operation is known, and the controller of the memory can issuecommands that adjust operation of the cell, for example, by treating thecell or block of cells differently depending upon the particular issuethe cell or block of cells has. If the cell programs faster than thecells around it, the controller can adjust the programming of that cellto suit its particular issue by programming with a smaller number ofpulses, for example. If the cell programs slower than the cells aroundit, the controller can adjust the programming of that cell byprogramming with a larger number of pulses, or with a larger step-upvoltage between pulses, for example. If the cell has a high error rateon programming and/or sensing, for example higher than a certainpercentage or number of errors, or if the cell has a threshold voltagevariance of a certain amount or percentage, the controller can adjustthe programming and/or sensing or exclude the cell.

The same methods and embodiments described herein for use with a singlecell are amenable to use with blocks, strings, columns, sections, etc. .. . , of cells that program or sense faster or slower, or have higherror rates or threshold voltage variations, than the cells, or blocks,strings, columns, sections, etc. . . . , of cells, around them.

In one embodiment, a table is generated using results from programmingand/or sensing operations that has identified atypical programmingand/or sensing cells (or blocks, strings, columns, sections, etc. . . ., of cells) by location and type of atypical operation (sometimes alsoreferred to as condition). Criteria are set up that can be used tomonitor for programming and/or sensing conditions of the cells that areatypical. If a cell, or block, string, column, section, etc. . . . , ofcells, is outside the criteria set up, then an action is taken based onthe criteria or condition. For example, conditions include in one ormore embodiments programming and/or sensing slower or faster by apercentage amount, programming and/or sensing faster or slower by anamount of time or a number of pulses, having an error rate outside acertain error rate percentage, having a threshold voltage variance ofmore than a certain amount or a certain percentage from a mean thresholdvoltage for the memory, etc. . . . .

Operation of a cell is accomplished in one embodiment by checking thetable of atypical cells when an address is received for programming orsensing, and taking an action based upon the type of atypical operationstored in the table when the received address matches a cell in thetable. Actions include by way of example only and not by way oflimitation, programming a redundant cell, element, block, string,column, section, etc. . . . ; blocking the cell, or block, string,column, section, etc. . . . , of cells, from programming and/or sensing;ignoring the cell and marking the cell, or block, string, column,section, etc. . . . , of cells, unusable, that is, blocking the cell orcells from storage uses.

A method 600 for operating a multi-level cell memory such as thosedescribed herein is shown in FIG. 6. Method 600 comprises storinglocations of cells having one or more atypical operation issues in thememory in a table or register in block 602, and adjusting programming ofatypical cells when an atypical cell is to be programmed in block 604.

Adjusting can be accomplished in a number of ways. In one embodiment,adjusting comprises programming a redundant cell instead of the cellthat is addressed. In another embodiment, adjusting programmingcomprises programming the cell to compensate for its known atypicalprogramming operation, for example programming or sensing the cellslower if it is a fast programming or sensing cell or programming orsensing the cell faster if it is a slower programming or sensing cell.In another embodiment, adjusting programming comprises marking the cellas unusable when the programming speed or other condition of the cell isoutside a criteria. Conditions include, by way of example only and notby way of limitation, programming at a certain percentage faster orslower than an average programming speed for the memory, programmingfaster or slower by an amount of time or a number of pulses, change inthreshold voltage by a certain amount over time, error rate forprogramming in excess of a certain rate or number of errors, etc. . . .. In one embodiment, when a cell is marked unusable, a redundant cell isprogrammed.

In another embodiment 700 shown in FIG. 7, a table 702 is shown inmemory device 101 connected to receive information from and conveyinformation to control logic 116. Table 702 is a storage table such asthose described above, for storing cell locations and types of atypicaloperation for cells of the array 104 having atypical operation.

While the embodiments described herein have been discussed with respectto individual cells, it should be understood that multiple cells,including cells in a row or column, cells in a block, cells in a page,etc. . . . , may exhibit atypical programming, and that the embodimentsare amenable to use with blocks, sections, rows, columns, strings,pages, or any portion of a memory array without departing from the scopeof the disclosure.

Methods of programming faster cells are discussed in greater detail inco-owned, co-pending patent application entitled “PROGRAMMING RATEIDENTIFICATION AND CONTROL IN A SOLID STATE MEMORY.” Such methods areamenable to use with the various embodiments of the present disclosurewithout departing from the scope thereof.

The various embodiments include methods of programming and/or sensingmulti-level cell memory devices including programming and/or sensingcompensation for atypical operation cells, and memory devices employingthose methods, including memory devices such as those described in FIGS.1-5. In one or more embodiments, this is facilitated by storing a tableof known atypical operation cells and types, or conditions, for thosecells, and adjusting operation of those cells when an operation is to beperformed on the cells.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe disclosure will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the disclosure.

What is claimed is:
 1. A memory device, comprising: an array of memorycells; and a controller configured to store in a storage areaidentification information and an indication of a type of atypicaloperation for a cell in the memory having atypical operation, and toadjust operation of the atypical cell using the identificationinformation and the type; wherein the memory device adjusts operation bysensing the cell with a different sensing algorithm when the type ofatypical operation is an atypical sensing, and adjusts operation byprogramming the cell with a different programming operation when thetype of atypical operation is an atypical programming.
 2. The memorydevice of claim 1, wherein the controller adjusts operation byprogramming a redundant cell when the type of atypical operationindicates the cell is unusable.
 3. The memory device of claim 1, whereinthe storage area is a lookup table.
 4. A memory device, comprising: anarray of memory cells; and a controller configured to store in a storagearea identification information and an indication of a type of atypicaloperation for a cell in the memory having atypical operation, and toadjust operation of the atypical cell using the identificationinformation and the type; wherein the controller is configured to adjustatypical operation comprising at least one of a cell programming apercentage faster than a mean average programming time, a cellprogramming a percentage slower than a mean average programming time, acell not programming at all, a cell programming or sensing with an errorrate higher than a set rate, and a cell varying in threshold voltage bymore than a percentage from a mean threshold voltage.
 5. The memorydevice of claim 4, wherein the controller adjusts operation byprogramming a cell with a slower programming algorithm when the type ofatypical operation comprises programming faster than a mean cell programtime by a predetermined amount.
 6. The memory device of claim 4, whereinthe controller adjusts operation by programming a cell with a fasterprogramming algorithm when the type of atypical operation comprisesprogramming slower than a mean cell program time by a predeterminedamount.
 7. The memory device of claim 4, wherein the controller adjustsby sensing a cell with a faster sensing algorithm when the type ofatypical operation comprises sensing slower than a mean cell sense timeby a predetermined amount.
 8. The memory device of claim 4, wherein thecontroller adjusts by sensing a cell with a slower sensing algorithmwhen the type of atypical operation comprises sensing faster than a meancell sense time by a predetermined amount.
 9. The memory device of claim4, wherein the controller adjusts operation by marking a cell unusablewhen the type of atypical operation comprises an operation speeddiffering from an average operation speed for the memory by apercentage; and programming a redundant cell when the type of atypicaloperation indicates the cell is unusable.
 10. A memory device,comprising: an array of memory cells; a lookup table; and a controllerconfigured to store in the lookup table information and an indication ofa type of atypical operation for a cell in the memory having atypicaloperation, and to adjust operation of the atypical cell using theidentification information and the type, wherein the controller adjustsoperation by sensing the cell with a different sensing algorithm whenthe type of atypical operation atypical sensing, and programming thecell with a different programming operation when the type of atypicaloperation is an atypical programming.
 11. A memory device, comprising:an array of memory cells; a lookup table; and a controller configured tostore in the lookup table information and an indication of a type ofatypical operation for a cell in the memory having atypical operation,and to adjust operation of the atypical cell using the identificationinformation and the type, wherein the controller adjusts operation byone of sensing the cell with a different sensing algorithm, orprogramming the cell with a different programming operation; wherein thecontroller is further configured to mark a cell unusable when the typeof atypical operation comprises an operation speed differing from anaverage operation speed for the memory by a percentage, and to program aredundant cell when the type of atypical operation indicates the cell isunusable.
 12. A memory device, comprising: an array of memory cells; acontroller for communicating with an external device; circuitry forcontrol and/or access of non-volatile memory cells of the memory device;and a storage table to store cell location and cell operationinformation for a memory cell of the array having atypical operation,the circuitry adapted to adjust operation of each cell having anatypical operation by sensing the cell with a different sensingalgorithm when the type of atypical operation is an atypical sensing,and programming the cell with a different programming algorithm when thetype of atypical operation is an atypical programming.
 13. The memorydevice of claim 12, wherein the storage table is populated using resultsfrom memory device operations identifying atypical operation.
 14. Thememory device of claim 12, wherein the storage table is a lookup table.15. The memory device of claim 12, wherein the storage table is aregister.
 16. A memory device, comprising: an array of memory cells;circuitry for control and/or access of the array of memory cells; and astorage area to store identification and atypical operation informationfor a cell that has an atypical operation; the control circuitry adaptedto adjust operation of a cell when the cell has an atypical operation,wherein adjusting operation comprises adjusting for at least one of acell programming a percentage faster than a mean average programmingtime, a cell programming a percentage slower than a mean averageprogramming time, a cell not programming at all, a cell programming orsensing with an error rate higher than a set rate, and a cell varying inthreshold voltage by more than a percentage from a mean thresholdvoltage.
 17. The memory device of claim 16, wherein the controlleradjusts operation by programming a cell with a slower programmingalgorithm when the type of atypical operation comprises programmingfaster than a mean cell program time by a predetermined amount.
 18. Thememory device of claim 16, wherein the controller adjusts operation byprogramming a cell with a faster programming algorithm when the type ofatypical operation comprises programming slower than a mean cell programtime by a predetermined amount.
 19. The memory device of claim 16,wherein the controller adjusts by sensing a cell with a faster sensingalgorithm when the type of atypical operation comprises sensing slowerthan a mean cell sense time by a predetermined amount.
 20. The memorydevice of claim 16, wherein the controller adjusts by sensing a cellwith a slower sensing algorithm when the type of atypical operationcomprises sensing faster than a mean cell sense time by a predeterminedamount.